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  For more details,  please email us at
   
  info@nexray.biz
   

AWPb 300 Automatic Wafer Bumper System

Fully automated 200 / 300mm EFEM wafer capability

Milara takes its combined system technology practice one step further with the development of the new AWPb 300 Wafer Printer / Bumper system. It is capable of handling 150, 200 and 300mm wafers with either a dual or single FOUP option. A single robotic arm with pre-aligner is used to load and unload wafers onto the automated print stage (EFEM). Utilizing our patented vibration squeegee technology which has proven viability in wafer bumping, the AWPb 300 employs the same technology used by all Milara printers to accomplish ultra fine pitch printing (down to 38um) with 100 percent printing reliability in conjunction with unsurpassed solder brick geometry.

The AWPb 300, fully automatic robotic wafer bumper offers advanced technological features and combines them with unprecedented ease of operation. Windows™ Professional based programming simplifies every aspect of set-up. A customized windows based system allows either first time or experienced operators to use the printer’s full capabilities in just a sort time. The AWPb 300 is engineered to achieve the highest levels of precision and consistency in paste deposition. A self-diagnostic program for instant trouble shooting is built in to ensure maximum productivity.


Patented vibration squeegee technology

The world’s first industrial vibrating squeegee from Milara provides multiple benefits including lower squeegee pressures, longer stencil life, consistent paste deposition and eliminates paste scavenging. Higher print speeds, and improving print quality are also achieved through this major break-through in printing technology. Absolute solder paste deposition onto the wafer is achieved with this patented technology.
 

Bottom Side Stencil Cleaning (Patented)

Bottom side stencil cleaning is a critical aspect of high quality printing and a definite consideration in overall production cycle time. The AWPb 300 accomplishes this operation by incorporating a tri-blade ultrasonic vibration wiper system.
 

Dual or Single load port available